Wafer processing, bare die shipment
Leave the processing of semiconductor wafers and the shipment of bare dies to us!
We handle assembly processing of semiconductor wafers. - Available wafer diameters: 6 to 12 inches - We can perform back grinding (backside polishing) of wafers only, and shipping after dicing with laser grooving/blade is also possible. - The thickness distribution of wafers after backside polishing can be measured non-contact and non-destructively. - We can pick up specific dies from shuttle wafers and ship bare dies or perform package assembly. - If you provide the results of wafer tests in a map format, we can also accommodate inkless processing. - The condition of both sides of the dies will be inspected in full by automatic visual inspection machines. - For bare die shipments, you can choose between tray, dicing tape, or embossed tape (reel) packaging. 【Business Content】 - Processing and shipping support after the supply of semiconductor wafers - Automatic visual inspection of the front and back surfaces of wafers - Evaluation and analysis in the latter processes associated with die development
- Company：エスタカヤ電子工業
- Price：Other
